TOP500 List - June 1995

Rmax and Rpeak values are in GFlops. For more details about other fields, check the TOP500 description.

Rpeak values are calculated using the advertised clock rate of the CPU. For the efficiency of the systems you should take into account the Turbo CPU clock rate where it applies.

Rank System Cores Rmax (GFlop/s) Rpeak (GFlop/s) Power (kW)
1 Numerical Wind Tunnel, Fujitsu
National Aerospace Laboratory of Japan
Japan
140 170.0 235.8
2 XP/S140, Intel
Sandia National Laboratories
United States
3,680 143.4 184.0
3 XP/S-MP 150, Intel
DOE/SC/Oak Ridge National Laboratory
United States
3,072 127.1 154.0
4 T3D MC1024-8, Cray/HPE
Government
United States
1,024 100.5 153.6
5 VPP500/80, Fujitsu
National Lab. for High Energy Physics
Japan
80 98.9 128.0
6 CM-5/1056, Thinking Machines Corporation
Los Alamos National Laboratory
United States
1,056 59.7 135.2
7 VPP500/42, Fujitsu
Japan Atomic Energy Research Institute
Japan
42 54.5 67.2
8 CM-5/896, Thinking Machines Corporation
Minnesota Supercomputer Center
United States
896 52.3 114.7
9 T3D MC512-8, Cray/HPE
Los Alamos National Laboratory
United States
512 50.8 76.8
10 T3D MC512-8, Cray/HPE
Pittsburgh Supercomputing Center
United States
512 50.8 76.8
11 SP2/512, IBM
Cornell Theory Center
United States
512 44.2 136.2
12 SP2/400, IBM
Maui High-Performance Computing Center (MHPCC)
United States
400 44.2 106.4
13 SP2/256, IBM
IBM
United States
256 44.2 68.1
14 VPP500/30, Fujitsu
The Angstrom Technology Partnership
Japan
30 39.8 48.0
15 VPP500/30, Fujitsu
University of Tsukuba
Japan
30 39.8 48.0
16 VPP500/28, Fujitsu
Institute of Physical and Chemical Research (RIKEN)
Japan
28 37.2 44.8
17 XP/S-MP 41, Intel
Air Force Research Laboratory
United States
816 33.7 40.8
18 T3D MC320-8, Cray/HPE
University of Edinburgh
United Kingdom
320 31.7 48.0
19 CM-5/512, Thinking Machines Corporation
NCSA
United States
512 30.4 65.5
20 CM-5/512, Thinking Machines Corporation
National Security Agency
United States
512 30.4 65.5
21 SP2/160, IBM
NASA/Ames Research Center/NAS
United States
160 28.7 42.6
22 S-3800/480, Hitachi
Hitachi Ltd. Enterprise Server Division
Japan
4 28.4 32.0
23 S-3800/480, Hitachi
University of Tokyo
Japan
4 28.4 32.0
24 T3D SC256-8/264, Cray/HPE
Caltech/JPL
United States
256 25.3 38.4
25 T3D MC256-8, Cray/HPE
Cray Research
United States
256 25.3 38.4
26 T3D MC256-8, Cray/HPE
Defense Research Agency (DRA)
United Kingdom
256 25.3 38.4
27 T3D MC256-8, Cray/HPE
Ecole Polytechnique Federale de Lausanne
Switzerland
256 25.3 38.4
28 T3D SC256-8/464, Cray/HPE
Los Alamos National Laboratory
United States
256 25.3 38.4
29 T3D SC256-8/364, Cray/HPE
NERSC/LLNL
United States
256 25.3 38.4
30 SX-3/44R, NEC
Atmospheric Environment Service (AES)
Canada
4 23.2 25.6
31 SX-3/44R, NEC
NEC
Japan
4 23.2 25.6
32 SX-3/44R, NEC
Tohoku University
Japan
4 23.2 25.6
33 VPP500/16, Fujitsu
Fujitsu System Evaluation Center
Japan
16 21.7 25.6
34 VPP500/16, Fujitsu
Kyoto University
Japan
16 21.7 25.6
35 VPP500/16, Fujitsu
University of Tokyo/Institute for Solid State Physics
Japan
16 21.7 25.6
36 S-3800/380, Hitachi
Hokkaido University
Japan
3 21.6 24.0
37 S-3800/380, Hitachi
Institute for Materials Research, Tohoku University (IMR)
Japan
3 21.6 24.0
38 SX-3/44, NEC
Atmospheric Environment Service (AES)
Canada
4 20.0 22.0
39 T3D SC192-8/464, Cray/HPE
ZIB/Konrad Zuse-Zentrum fuer Informationstechnik
Germany
192 19.1 28.8
40 SX-3/34R, NEC
Institute for Molecular Science
Japan
3 17.4 19.2
41 XP/S35, Intel
Caltech
United States
512 15.2 26.0
42 XP/S35, Intel
DOE/SC/Oak Ridge National Laboratory
United States
512 15.2 26.0
43 CM-5/256, Thinking Machines Corporation
Geco-Prakla
United States
256 15.1 32.8
44 CM-5/256, Thinking Machines Corporation
Government
United States
256 15.1 32.8
45 CM-5/256, Thinking Machines Corporation
Naval Research Laboratory (NRL)
United States
256 15.1 32.8
46 CM-5/256, Thinking Machines Corporation
Thinking Machines
United States
256 15.1 32.8
47 Delta, Intel
Caltech
United States
512 13.9 20.5
48 Y-MP C916/16256, Cray/HPE
Cray Research
United States
16 13.7 15.2
49 Y-MP C916/16256, Cray/HPE
DKRZ - Deutsches Klimarechenzentrum
Germany
16 13.7 15.2
50 Y-MP C916/16256, Cray/HPE
DOE/Bettis Atomic Power Laboratory
United States
16 13.7 15.2
51 Y-MP C916/16256, Cray/HPE
DOE/Knolls Atomic Power Laboratory
United States
16 13.7 15.2
52 Y-MP C916/16256, Cray/HPE
ECMWF
United Kingdom
16 13.7 15.2
53 Y-MP C916/161024, Cray/HPE
ERDC DSRC
United States
16 13.7 15.2
54 Y-MP C916/16512, Cray/HPE
Ford Motor Company
United States
16 13.7 15.2
55 Y-MP C916/16512, Cray/HPE
Ford Motor Company
United States
16 13.7 15.2
56 Y-MP C916/161024, Cray/HPE
Government
United States
16 13.7 15.2
57 Y-MP C916/161024, Cray/HPE
Government
United States
16 13.7 15.2
58 Y-MP C916/161024, Cray/HPE
Government
United States
16 13.7 15.2
59 Y-MP C916/161024, Cray/HPE
Government
United States
16 13.7 15.2
60 Y-MP C916/16512, Cray/HPE
Government
United States
16 13.7 15.2
61 Y-MP C916/16256, Cray/HPE
Government Communications Headquarters
United Kingdom
16 13.7 15.2
62 Y-MP C916/16512, Cray/HPE
KISTI Supercomputing Center
South Korea
16 13.7 15.2
63 Y-MP C916/16256, Cray/HPE
MITI - AIST - RIPS
Japan
16 13.7 15.2
64 Y-MP C916/161024, Cray/HPE
NASA/Ames Research Center/NAS
United States
16 13.7 15.2
65 Y-MP C916/16256, Cray/HPE
NERSC/LLNL
United States
16 13.7 15.2
66 Y-MP C916/16256, Cray/HPE
NOAA
United States
16 13.7 15.2
67 Y-MP C916/16512, Cray/HPE
National Security Agency
United States
16 13.7 15.2
68 Y-MP C916/161024, Cray/HPE
Naval Oceanographic Office - NAVO DSRC
United States
16 13.7 15.2
69 Y-MP C916/16512, Cray/HPE
Pittsburgh Supercomputing Center
United States
16 13.7 15.2
70 Y-MP C916/161024, Cray/HPE
Tohoku University, Institute of Fluid Science
Japan
16 13.7 15.2
71 Y-MP C916/16256, Cray/HPE
United Kingdom Meteorological Office
United Kingdom
16 13.7 15.2
72 VPP500/10, Fujitsu
Communications Res. Lab. (CRL)
Japan
10 13.6 16.0
73 T3D MC128-8, Cray/HPE
Air Force/Eglin Air Force Base
United States
128 12.8 19.2
74 T3D MC128-8, Cray/HPE
Commissariat a l'Energie Atomique (CEA)
France
128 12.8 19.2
75 T3D MCA128-8, Cray/HPE
Commissariat a l'Energie Atomique (CEA)
France
128 12.8 19.2
76 T3D MC128-8, Cray/HPE
Cray Research
United States
128 12.8 19.2
77 T3D MCA128-8, Cray/HPE
ECMWF
United Kingdom
128 12.8 19.2
78 T3D MC128-8, Cray/HPE
Minnesota Supercomputer Center
United States
128 12.8 19.2
79 T3D MC128-8, Cray/HPE
Petroleum Company (A)
United States
128 12.8 19.2
80 T3D MC128-8, Cray/HPE
Phillips Petroleum Company
United States
128 12.8 19.2
81 T3D MCA128-2, Cray/HPE
Reactor & Nuclear Fuel Development
Japan
128 12.8 19.2
82 T3D MCA128-8, Cray/HPE
Tohoku University, Institute of Fluid Science
Japan
128 12.8 19.2
83 T3D MC128-8, Cray/HPE
University of Alaska - Arctic Region Supercomputing Center
United States
128 12.8 19.2
84 SP2/70, IBM
Leibniz Rechenzentrum
Germany
70 12.5 18.6
85 XP/S-MP 14, Intel
DOE/SC/Oak Ridge National Laboratory
United States
288 12.0 14.4
86 XP/S30, Intel
UCSD/San Diego Supercomputer Center
United States
400 11.9 20.0
87 SX-3/24R, NEC
German Aerospace Laboratory (DLR)
Germany
2 11.6 12.8
88 SX-3/24R, NEC
NEC
Japan
2 11.6 12.8
89 SX-3/24R, NEC
National Institute for Fusion Science (NIFS)
Japan
2 11.6 12.8
90 SX-3/24R, NEC
Swiss Scientific Computing Center (CSCS)
Switzerland
2 11.6 12.8
91 CM-5/192, Thinking Machines Corporation
Geco-Prakla
United States
192 11.4 24.6
92 SP2/64, IBM
CERN
Switzerland
64 11.4 17.0
93 SP2/64, IBM
Maui High-Performance Computing Center (MHPCC)
United States
64 11.4 17.0
94 SP2/59, IBM
Pennsylvania State University
United States
59 10.5 15.7
95 XP/S25, Intel
National Aerospace Laboratory of Japan
Japan
336 10.0 16.8
96 XP/S25, Intel
Space and Naval Warfare Systems Center (NRAD)
United States
336 10.0 16.8
97 SP2/55, IBM
KTH - Royal Institute of Technology
Sweden
55 9.8 14.6
98 CM-200/64k, Thinking Machines Corporation
Los Alamos National Laboratory
United States
2,048 9.8 20.0
99 CM-200/64k, Thinking Machines Corporation
Los Alamos National Laboratory
United States
2,048 9.8 20.0
100 VPP500/7, Fujitsu
Institute of Space & Astronautical Science (ISAS)
Japan
7 9.7 11.2