Episode 169: Addison Snell and Michael Feldman discuss a new supercomputing application that could be used in a gerrymandering case before the Supreme Court, and a Russian attempt to display its HPC prowess backfires.
Huawei and Intel have signed a memorandum of understanding (MOU) to cooperate on high performance computing products and technology innovation. The MOU was made public at Hannover Messe, a conference that focuses on advanced industrial technology.
Silicon Valley startup Wave Computing announced its dataflow compute appliance for machine learning is now available via an early access program, with general availability scheduled for Q4 2017. According to the company, its custom-built appliance can deliver 2.9 petaops of performance and train neural networks an order of magnitude faster than the current crop of GPU-accelerated hardware.
A 30-node cluster of GPU-accelerated IBM “Minsky” servers has performed a billion-cell petroleum reservoir simulation in 92 minutes. Previous attempts at this scale required 20 hours using a large supercomputer with thousands of processors.
Fujitsu Laboratories has developed a circuit technology that is said to improve the energy efficiency of deep learning workloads. According to the company, it plans to commercialize the technology in 2018 as part of its Human Centric AI Zinrai initiative.
Simon Fraser University (SFU) has officially launched Canada’s most powerful academic supercomputer. The new 3.6-petaflop system, known as “Cedar,” is just the beginning of a big push by the Canadian government to upgrade the network of its 50 aging HPC machines used to serve the nation’s academic research community.
In a surprise announcement sent out on Wednesday, Intel revealed it will discontinue their biggest tradeshow of the year: the Intel Developer Forum (IDF). The company explained the move as a result of an evolving event calendar that features more targeted product sets.
Rescale, Intel, and R Systems have teamed up to provide an HPC cloud equipped with Intel’s “Knights Landing” Xeon Phi processors and the Omni-Path interconnect. The new platform, known as ScaleX Labs with Intel, is the first to bring this technology duo into the cloud computing realm.