IBM is looking to take a bigger slice out of Intel’s lucrative server business with Power9, the company’s latest and greatest processor for the datacenter. Scheduled for initial release in 2017, the Power9 promises more cores and a hefty performance boost compared to its Power8 predecessor. The new chip was described at the Hot Chips event, which took place in Silicon Valley this week.
The prospects for another serious rival to the x86 processor in the high performance computing space are looking much better this week after ARM Holdings presented the company’s plan to offer an HPC version of its 64-bit architecture. Known as ARMv8-A SVE, the design incorporates a technology known as the Scalable Vector Extension (SVE), which will provide a unique type of flexibility with regard to vector processing -- the basis of many scientific and engineering workloads.
At the Hot Chips symposium taking place in Cupertino, California this week, Samsung and SK hynix touted their latest efforts for high bandwidth memory (HBM), including the third iteration of the technology, known as HBM3. This new version promises to double bandwidth and density, while taking more direct aim at the high performance computing market.
The goal of integrating lasers and semiconductors reached its commercial fruition this week as Intel announced it is shipping 100G silicon photonics transceivers to customers. The technology, which puts lasers onto a CMOS substrate, promises to bring down the costs and power of optical communications in the datacenter.